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Sample Preparation Laboratory
Facilities available are:- Polishing, Thin Section Preparation and
Rock Sawing/Coring
Polishing includes the preparation of :-
Polished Blocks (from 2.5 to 7.6cm diameter)
Polished Single Grains (from 50mm to 3mm)
Polished Multiple Grain Mounts (up to 2.6 x 4.8cm)
Standard Polished Probe Thin Sections (2.6 x 4.8cm) and (5.1 x 7.6cm)
Doubly Polished Wafers (up to a maximum of 3.0cm diameter)
Polished Slices for Laser Probing (up to maximum of 5.1 x 7.6cm)
Kent Polishing and Lapping Equipment
Thin Section Preparation includes the preparation of :-
Standard Thin Section (2.54 x 7.6cm - normal 1" x 3" slide)
Large Thin Section (5.1 x 7.6cm)
Partially Polished Thin Section for Cathodoluminescence (2.54 x 7.6cm)
Uncovered Thin Sections for Staining Techniques (2.54 x 7.6cm)
Petro Thin Trim saw and Logitech Lp30
Rock Sawing / Coring
Diamond impregnated sawing blades, maximum diameter 23cm (9")
Diamond impregnated wafering saw, maximum diameter 10cm (4")
Diamond Coring 2.54cm to a maximum of 5.7cm and to a depth of 10cm
Higland Park Rock Saw
For more Information E-mail:John.Gilleece@ges.gla.ac.uk
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